High-temperature wire sweep characteristics of semiconductor package for variable loop-height wirebonding technology
Author:
Publisher
Elsevier BV
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference17 articles.
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3. L.T. Nguyen, ASME annual meeing, Anaheim, CA, 1992, pp. 23–78.
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