Comparison of HF and HCl cross-contamination between different ENTEGRIS FOUP platforms and Cu-coated wafers-Reference-Cited by-同舟云学术

Comparison of HF and HCl cross-contamination between different ENTEGRIS FOUP platforms and Cu-coated wafers

Published:2017-02 Issue: Volume:169 Page:34-38
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Herrán Fernando,González-Aguirre Paola,Beitia Carlos,Ohlsen Jim,Lundgren Jorgen,Fontaine Hervé

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. Case study of micro-contamination control;Li;Aerosol Air Qual. Res.,2007

2. The Influence and Measurement of Airborne Molecular Contaminants in Advanced Semiconductor Processing;Ayre,2005

3. Airborne molecular contamination: cleanroom control strategies;Higley;Solid State Technology,1996

4. Controlling ambient gas in slot-to-slot space inside FOUP to suppress Cu-loss after dual damascene patterning;Kamoshima;IEEE Trans. Semicond. Manuf.,2008

5. Comprehensive study on Metal-Fluoride Crystals issues with Trench First Hard Mask Backend architecture;Lagha,2007

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Diffusivity and solubility of HF gas in polymers and nanocomposites used for automated handling containers of silicon substrates in microelectronic industry;Microelectronic Engineering;2023-01

2. Thermal atomic layer deposition of molybdenum carbide films using bis(ethylbenzene)molybdenum and H₂;Journal of Vacuum Science & Technology A;2023-01

3. A Numerical Study on the Effects of Purge and Air Curtain Flow Rates on Humidity Invasion Into a Front Opening Unified Pod (FOUP);IEEE Transactions on Semiconductor Manufacturing;2022-11

4. Experimental Wafer Carrier Contamination Analysis and Monitoring in Fully Automated 300 mm Power Production Lines;Solid State Phenomena;2021-02

5. Transport Coefficients of Ammonia Gas in Thermoplastic Polymers and Nanocomposites Used for Microelectronic Substrates Containers;Diffusion Foundations;2020-05