Author:
Youn Hongmin,Kim Sunjung,Kim Soo-Hyun
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference26 articles.
1. Electrodeposition of copper thin film on ruthenium: a potential diffusion barrier for Cu interconnects;Chyan;J. Electrochem. Soc.,2003
2. Diffusion barrier effects of transition metals for Cu/M/Si multilayers (M=Cr, Ti, Nb, Mo, Ta, W);Ono;Appl. Phys. Lett.,1994
3. Void-free trench-filling by electroless copper deposition using the combination of accelerating and inhibiting additives;Hasegawa;Electrochem. Solid-State Lett.,2006
4. Thermal stability of sputtered tungsten carbide as diffusion barrier for copper metallization;Wang;J. Electrochem. Soc.,2001
5. Atomic layer deposition (ALD): from precursors to thin film structures;Leskelä;Thin Solid Films,2002
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