The effect of citric acid based cleaning solution on particle adhesion and removal during post-Cu CMP cleaning-Reference-Cited by-同舟云学术

The effect of citric acid based cleaning solution on particle adhesion and removal during post-Cu CMP cleaning

Published:2019-08 Issue: Volume:216 Page:111090
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Zhang Lifei^ORCID,Wang Tongqing,Lu Xinchun

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference18 articles.

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3. Minimization of Chemical-Mechanical Planarization(CMP) Defects and Post-CMP Cleaning;Zhang,2017

4. Copper in organic acid based cleaning solutions;Pernel;J. Vac. Sci. Technol. B Microelectron. Nanom. Struct.,2006

5. Investigation of cleaning solution composed of citric acid and 5-aminotetrazole;Kwon;Korean J. Chem. Eng.,2011

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