Front- to back-side overlay optimization after wafer bonding for 3D integration-Reference-Cited by-同舟云学术

Front- to back-side overlay optimization after wafer bonding for 3D integration

Published:2006-04 Issue:4-9 Volume:83 Page:1229-1232
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Marinier Laurent,van Noort Wibo,Pellens Rudy,Sutedja Budiman,Dekker Ronald,van Zeijl Henk

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference8 articles.

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4. H.W. van Zeijl, PhD Thesis, Delft University of Technology, 2005, ISBN 90–8559–045-0.

5. F.G.C. Bijnen, W.v. Buel, C.Q Gui, J. Lof, Emerging Lithographic Technologies VII, Proc. SPIE, vol. 5037, 2003.

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