Author:
Laurent Ph.,Stoukatch S.,Dupont F.,Kraft M.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. Chapter 2. Low-temperature microassembly methods and integration techniques for biomedical applications;Stoukatch,2016
2. Evaluation of aerosol jet printing (AJP) technology for electronic packaging and interconnect technique;Stoukatch,2012
3. Conductivity enhancement of aerosol-jet printed electronics by using silver nanoparticles ink with carbon nanotubes;Zhao;J. Microelectron. Eng.,2012
4. Additive manufacturing technologies compared: morphology of deposits of silver ink using inkjet and aerosol jet printing;Seifert;Ind. Eng. Chem. Res.,2015
5. Rheological behaviors and their correlation with printing performance of silver paste for LTCC tape;Alias,2012
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