Modeling and simulation of stamp deflections in nanoimprint lithography: Exploiting backside grooves to enhance residual layer thickness uniformity

Author:

Taylor Hayden,Smistrup Kristian,Boning Duane

Funder

Singapore-MIT Alliance

Danish National Advanced Technology Foundation

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference5 articles.

1. T. Nielsen, R.H. Pedersen, O. Hansen, T. Haatainen, A. Tollki, J. Ahopelto, and A. Kristensen “Flexible Stamp for Nanoimprint Lithography,” Proc. 18th IEEE Conf. MEMS, January, 2005, pp. 508–511.

2. H. Taylor, D. Boning, “Fast simulation of pattern dependencies in thermal nanoimprint lithography,” Presented at Nanoimprint and Nanoprint Technology Conf., San Jose, CA, USA, November, 2009.

3. H.K. Taylor, D.S. Boning, “Toward Nanoimprint Lithography-Aware Layout Design Checking”, Proc. SPIE, vol. 7641, 764129, 2010.

4. Influence of a hard surface layer on the limit of elastic contact – Part I: Analysis using a real surface model;Nogi;Trans. ASME,1997

5. R.H. Pedersen, O. Hansen, A. Kristensen, A compact system for large-area thermal nanoimprint lithography using smart stamps, J. Micromech. Microeng. 18 (2008) 055018.

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