Optimization of reactive ion etching processes using desirability-Reference-Cited by-同舟云学术

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Optimization of reactive ion etching processes using desirability

Published:2010-05 Issue:5-8 Volume:87 Page:1413-1415
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Brabender Stephan,Kallis Klaus T.,Keller Lars O.,Poloczek Remigius R.,Fiedler Horst L.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. Response Surface Methodology: Process and Product Optimization Using Designed Experiments;Myers,1995

2. Design and Analysis of Experiments – Introduction to Experimental Design;Hinkelmann,1994

3. Empirical Model-building and Response Surfaces;Box,1994

4. Multivariate Statistik;Hartung,1989

5. Multicriteria decision making

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2. Central composite designs coupled with simulation techniques for optimizing RIE process;The International Journal of Advanced Manufacturing Technology;2013-10-18

3. Fluorine-free high-resolution selective plasma etching of silicon-oxide layers on silicon substrates;Journal of Physics D: Applied Physics;2010-09-14

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