Enhanced performance of pinned metal foam heat sinks with dielectric coolant – A pore-scale numerical study-Reference-Cited by-同舟云学术

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Enhanced performance of pinned metal foam heat sinks with dielectric coolant – A pore-scale numerical study

Published:2023-12 Issue: Volume:149 Page:107111
ISSN:0735-1933
Container-title:International Communications in Heat and Mass Transfer
language:en
Short-container-title:International Communications in Heat and Mass Transfer

Author:

Liaw Kim Leong,Ahmadihosseini Adel,Rosle Amir Farid Haziq Bin,Kurnia Jundika C.,Sasmito Agus P.

Funder

Fonds de recherche du Québec – Nature et technologies

NSERC

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference50 articles.

1. Experimental investigation of the effects of using nano/phase change materials (NPCM) as coolant of electronic chipsets, under free and forced convection;Alimohammadi;Appl. Therm. Eng.,2017

2. Designing thermoelectric self-cooling system for electronic devices: experimental investigation and model validation;Liu;Energy,2022

3. Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: a review;He;Energy,2021

4. Fluid Mechanics: Fundamentals and Applications;Çengel,2010

5. Passive mixing in microchannels: fabrication and flow experiments;Beebe;Mécanique Ind.,2001

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Pore-scale modeling of gas diffusion layers: Investigation of gas-liquid two-phase transport properties;International Journal of Heat and Mass Transfer;2024-09

2. Heat transfer analysis of subcooled flow boiling in copper foam helical coiled heat exchanger – A pore-scale numerical study;International Communications in Heat and Mass Transfer;2024-06

3. Heat transfer and flow characteristics of a plate-fin heat sink equipped with copper foam and twisted tapes;Heliyon;2024-06

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