Pool boiling heat transfer enhancement and bubble visualization on a microporous copper over CuO filmed surface through combination of chemical etching and electrochemical deposition-Reference-Cited by-同舟云学术

Pool boiling heat transfer enhancement and bubble visualization on a microporous copper over CuO filmed surface through combination of chemical etching and electrochemical deposition

Published:2023-05 Issue: Volume:144 Page:106740
ISSN:0735-1933
Container-title:International Communications in Heat and Mass Transfer
language:en
Short-container-title:International Communications in Heat and Mass Transfer

Author:

Kalita Sanjib,Sen Dipak,Sen Pulak,Das Sudev,Saha Bidyut Baran

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference66 articles.

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