Two-phase active immersion cooling for vertically mounted electronics with interchip component-assisted bubble departure

Author:

Ejaz Faizan,Kwon Beomjin

Funder

Arizona State University Ira A Fulton Schools of Engineering

National Research Foundation of Korea

Publisher

Elsevier BV

Reference49 articles.

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3. Assessment of high-heat-flux thermal management schemes;Mudawar,2001

4. Saturation boiling of HFE-7100 from a copper surface, simulating a microelectronic chip;El-Genk;Int. J. Heat Mass Transf.,2003

5. Experimental investigation of saturation boiling of HFE-7000 dielectric liquid on rough copper surfaces;El-Genk;Therm. Sci. Eng. Prog.,2020

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