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Heat transfer performance study of microchannel heat sink with composite secondary channels

  • Published:2023-04 Issue: Volume:143 Page:106718
  • ISSN:0735-1933
  • Container-title:International Communications in Heat and Mass Transfer
  • language:en
  • Short-container-title:International Communications in Heat and Mass Transfer

Author:

Wen Haiping,Liang Zhixuan,Luo Qingyi,Wu Chili,Wang Changhong

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference35 articles.

1. Low-temperature two-phase microchannel cooling for high-heat-flux thermal management of defense electronics;Jaeseon;IEEE Trans. Comp. Pack. Technol.,2009

2. Samsher, heat transfer augmentation in microchannel heat sink using secondary flows: a review;Hussam;Int. J. Heat Mass Transf.,2022

3. High-performance heat sinking for VLSI;Tuckerman;IEEE Elect. Device Lett.,1981

4. Assessment of heat transfer and pressure drop of metal foam-pin-fin heat sink;Alfellag;Int. J. Therm. Sci.,2021

5. Numerical simulation of fluid flow and heat transfer in a microchannel heat sink with offset fan-shaped reentrant cavities in sidewall;Chai;Int. Commun. Heat Mass Transf.,2011
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