Author:
Chen Xi,Li Hao,Han Xiaotian,Liu Xiangdong
Funder
National Natural Science Foundation of China
Reference42 articles.
1. Thermal issues in next-generation integrated circuits;Gurrum;IEEE T Device Mat. Re,2004
2. Thermal challenges in next-generation electronic systems;Garimella;IEEE T Compon Pack T,2008
3. Thermal performance of a radial heat sink with longitudinal wavy fins for electronic cooling applications under natural convection;Rath;J. Therm. Anal. Calorim.,2022
4. Three-dimensional splitting microfluidics;Chen;Lab Chip,2016
5. Condensation in microchannels;Chen;Nanoscale Microscale Thermophys. Eng.,2008
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