A liquid metal cooling system for the thermal management of high power LEDs-Reference-Cited by-同舟云学术

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A liquid metal cooling system for the thermal management of high power LEDs

Published:2010-08 Issue:7 Volume:37 Page:788-791
ISSN:0735-1933
Container-title:International Communications in Heat and Mass Transfer
language:en
Short-container-title:International Communications in Heat and Mass Transfer

Author:

Deng Yueguang,Liu Jing

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference19 articles.

1. Design optimization on the heat transfer and mechanical reliability of High Brightness Light Emitting Diodes (HBLED) package;Gao,2008

2. Thermal management of LEDs: package to system;Arik,2003

3. Advances in LED packaging and thermal management materials;Zweben,2008

4. Directly synthesizing CNT-TIM on aluminum alloy heat sink for HB-LED thermal management;Kai,2008

5. Improved heat-dissipating silicone by nano-materials for LED packaging;Cao,2008

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3. Actuation technique of liquid metal in thermal management: A review;Applied Thermal Engineering;2024-07

4. Liquid metal manifold microchannel heat sink for ultra-high heat flux cooling;Applied Thermal Engineering;2024-07

5. GENERALIZED THERMAL OPTIMIZATION METHOD FOR THE PLATE-FIN HEAT SINKS OF HIGH LUMEN LIGHT EMITTING DIODE ARRAYS;Isı Bilimi ve Tekniği Dergisi;2024-06-03

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