Mechanical phenomena of a new-type anisotropic conductive film adhering to the outer lead bonding

Author:

Jong W.R.,Peng S.H.,Tsai H.C.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference13 articles.

1. Electronics manufacturing;Lau,2002

2. Reduced thermal strain if flip chip assemble on organic substrate using low CTE anisotropic conductive film;Yim;IEEE,2000

3. Effect of elastic recovery on the electrical contact resistance in anisotropic conductive adhesive assemblies, Components and Packaging Technologies;Chin;IEEE Transactions,2006

4. Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: an experimental study;Kwon;Microelectronics Reliability,2006

5. Flip chip attachment on flexible LCP substrate using an ACF;Frisk;Microelectronics Reliability,2005

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