Radio frequency-assisted curing of on-chip printed CNT/silicone heatsinks produced by material extrusion 3D printing

Author:

Tran Thang Q.,Sarmah AnubhavORCID,Harkin Ethan M.,Dasari Smita Shivraj,Arole KailashORCID,Cupich Matthew J.,Wright Aniela J.K.,Seet Hang Li,Nai Sharon Mui Ling,Green Micah J.

Funder

SIMTech

Texas A and M University

Agency for Science, Technology and Research

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Engineering (miscellaneous),General Materials Science,Biomedical Engineering

Reference47 articles.

1. Additive manufacturing of anisotropic graphene-based composites for thermal management applications;Ligati Schleifer;Addit. Manuf.,2023

2. Recent advances in design and preparation of polymer-based thermal management material;Zhang;Polymers,2021

3. FDM-3D printing LLDPE/BN@GNPs composites with double network structures for high-efficiency thermal conductivity and electromagnetic interference shielding;Peng;Compos. Part B Eng.,2023

4. 3D printing boron nitride nanosheets filled thermoplastic polyurethane composites with enhanced mechanical and thermal conductive properties;Gao;Addit. Manuf.,2022

5. A review of carbon-based thermal interface materials: Mechanism, thermal measurements and thermal properties;Guo;Mater. Des.,2021

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