Towards the additive manufacturing of Ni-Mn-Ga complex devices with magnetic field induced strain-Reference-Cited by-同舟云学术

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Towards the additive manufacturing of Ni-Mn-Ga complex devices with magnetic field induced strain

Published:2022-01 Issue: Volume:49 Page:102485
ISSN:2214-8604
Container-title:Additive Manufacturing
language:en
Short-container-title:Additive Manufacturing

Author:

Ituarte Iñigo Flores,Nilsén Frans,Nadimpalli Venkata Karthik,Salmi Mika,Lehtonen Joonas,Hannula Simo-Pekka

Funder

Ministerstvo Školství, Mládeže a Tělovýchovy

Aalto-Yliopisto

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Engineering (miscellaneous),General Materials Science,Biomedical Engineering

Reference44 articles.

1. Relation between structure, magnetisation process and magnetic shape memory effect of various martensites occurring in Ni-Mn-Ga alloys;Heczko;J. Phys. IV Fr.,2003

2. Twinning stress in shape memory alloys: theory and experiments;Wang;Acta Mater.,2013

3. High-cycle fatigue of 10M Ni-Mn-Ga magnetic shape memory alloy in reversed mechanical loading;Aaltio;Smart Mater. Struct.,2010

4. 12% magnetic field-induced strain in Ni-Mn-Ga-based non-modulated martensite;Sozinov;Appl. Phys. Lett.,2013

5. Twinning stress of type I and type II deformation twins;Müllner;Acta Mater.,2019

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2. Effect of heat treatment on phase transformation behavior and properties of Ni-Co-Mn-Al-Y shape memory alloy by laser direct energy deposition;Materials Characterization;2024-07

3. Process monitoring by deep neural networks in directed energy deposition: CNN-based detection, segmentation, and statistical analysis of melt pools;Robotics and Computer-Integrated Manufacturing;2024-06

4. Microstructure and texture control of Ni-Mn-Ga magnetic shape memory alloys manufactured by laser powder bed fusion;Additive Manufacturing;2024-04

5. Industrial IoT system for laser-wire direct energy deposition: data collection and visualization of manufacturing process signals;IOP Conference Series: Materials Science and Engineering;2023-12-01

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