One-step electrodeposition of copper on conductive 3D printed objects

Author:

Kim Myung JunORCID,Cruz Mutya A.,Ye Shengrong,Gray Allen L.,Smith Gabriel L.,Lazarus Nathan,Walker Christopher J.,Sigmarsson Hjalti H.ORCID,Wiley Benjamin J.

Funder

National Science Foundation CAREER

National Science Foundation STTR Phase I

Department of Energy’s Kansas City National Security Campus, operated by Honeywell Federal Manufacturing & Technologies, LLC

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Engineering (miscellaneous),General Materials Science,Biomedical Engineering

Reference42 articles.

1. 3D Printing multifunctionality: structures with electronics;Espalin;Int. J. Adv. Manuf. Technol.,2014

2. Additive manufacturing methods and modeling approaches: a critical review;Bikas;Int. J. Adv. Manuf. Technol.,2016

3. 3D-printing technologies for electrochemical applications;Ambrosi;Chem. Soc. Rev.,2016

4. A simple, low-cost conductive composite material for 3D printing of electronic sensors;Leigh;PLoS One,2012

5. 3D printing electronic components and circuits with conductive thermoplastic filament;Flowers;Addit. Manuf.,2017

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