Additively manufactured copper alloy with heterogeneous nanoprecipitates-dislocation architecture for superior strength-ductility-conductivity synergy-Reference-Cited by-同舟云学术

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Additively manufactured copper alloy with heterogeneous nanoprecipitates-dislocation architecture for superior strength-ductility-conductivity synergy

Published:2024-03 Issue: Volume:84 Page:104100
ISSN:2214-8604
Container-title:Additive Manufacturing
language:en
Short-container-title:Additive Manufacturing

Author:

Wang Liqiang^ORCID,Qu Shuo^ORCID,Fu Huangliu,Zhou Xin,Hu Zongxin^ORCID,Wen Yaojie,Zhang Baicheng,Gan Bin,Song Xu^ORCID,Lu Yang^ORCID

Funder

University Grants Committee

Publisher

Elsevier BV

Reference75 articles.

1. Recent development of advanced precipitation-strengthened Cu alloys with high strength and conductivity: a review;Yang;Prog. Mater. Sci.,2023

2. High strength and high conductivity Cu alloys: a review;Yang;Sci. China Technol. Sci.,2020

3. Using high-pressure torsion for metal processing: Fundamentals and applications;Zhilyaev;Prog. Mater. Sci.,2008

4. Grain refinement response during twist extrusion of an Al-0.13% Mg alloy;Berta;Int. J. Mater. Res.,2007

5. Combining synergetic effects of gradient nanotwins and nanoprecipitates in heterogeneous bronze alloy;Shi;Acta Mater.,2022

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A review on copper alloys with high strength and high electrical conductivity;Journal of Alloys and Compounds;2024-06

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