New method to develop High temperature constitutive model of metal based on the Arrhenius-type model
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference29 articles.
1. Magnesium Properties - applications - potential;Mordike;Mater. Sci. Eng.,2001
2. Hot compression deformation behavior and processing maps of Mg-Gd-Y-Zr alloy;Chen;J. Mater. Eng. Perform.,2013
3. Constitutive analysis and hot deformation behavior of fine-grained Mg-Gd-Y-Zr alloys;Alizadeh;Mater. Trans. A.,2017
4. A critical review of experimental results and constitutive descriptions for metals and alloys in hot working;Lin;Mater. Des.,2011
5. Flow behavior modeling of the 7050 aluminum alloy at elevated temperatures considering the compensation of strain;Li;Mater. Des.,2012
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