Effects of bismuth and nickel on the microstructure evolution of Sn-Ag-Cu (SAC)-based solders
Author:
Funder
Analog Devices
Publisher
Elsevier BV
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference26 articles.
1. Evolution of nano-Ag3Sn particle formation on Cu-Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering;Tsao;J. Alloys. Compd.,2011
2. Review on microstructure evolution in Sn-Ag-Cu solders and its effect on mechanical integrity of solder joints;Sona;J. Mater. Sci. Mater. Electron.,2013
3. Intermetallic compound growth suppression at high temperature in SAC solders with Zn addition on Cu and Ni-P substrates;Kotadia;J. Alloys. Compd.,2012
4. Microstructure evolution observation for SAC solder joint: comparison between thermal cycling and thermal storage;Berthou;Microelectron. Reliab.,2009
5. Microstructural considerations for ultrafine lead free solder joints;Huang;Microelectron. Reliab.,2007
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