A new constitutive model and hot processing map of 5A06 aluminum alloy based on high-temperature rheological behavior and higher-order gradients
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference22 articles.
1. Recent development in aluminium alloys for the automotive industry;Miller;Mater. Sci. Eng. A,2000
2. Mechanical and tribological properties of 5A06 aluminum alloy at low temperature;Ye;Surf. Topogr.: Metrol. Prop.,2023
3. Deformation behavior of 5A06 aluminum alloy sheet for rapid gas forming at elevated temperature;Fan;Trans. Nonferrous Met. Soc. China,2012
4. Experimental study of macro–micro dynamic behaviors of 5A0X aluminum alloys in high velocity deformation;Yan;Mater. Sci. Eng. A,2014
5. Variation of strain rate sensitivity of an aluminum alloy in a wide strain rate range: mechanism analysis and modeling;Yan;J. Alloy. Compd.,2016
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