Large difference of lattice thermal conductivity between thermoelectric compounds Cu3VSe4 and Tl3VSe4: Elasticity, anharmonicity and chemical bonding from first-principles calculation-Reference-Cited by-同舟云学术

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Large difference of lattice thermal conductivity between thermoelectric compounds Cu3VSe4 and Tl3VSe4: Elasticity, anharmonicity and chemical bonding from first-principles calculation

Published:2023-12 Issue: Volume:37 Page:107505
ISSN:2352-4928
Container-title:Materials Today Communications
language:en
Short-container-title:Materials Today Communications

Author:

Yang Dingfeng^ORCID,Chen Shuling,Pu Hongzheng,Pi Mingyu,Li Yuanyuan

Funder

Chongqing Natural Science Foundation

Chongqing Municipal Education Commission

Chongqing Municipal Education Commission Foundation

National Natural Science Foundation of China

China Postdoctoral Science Foundation

Chongqing Municipal Science and Technology Bureau

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference44 articles.

1. A review on silicide-based materials: thermoelectric and mechanical properties;Kim;Met. Mater. Int.,2021

2. Mechanical properties of nanostructured thermoelectric materials α-MgAgSb;Liu;Scr. Mater.,2017

3. Thermoelectric performance and high-temperature creep behavior of GeTe-based thermoelectric materials;Zhang;J. Electron. Mater.,2011

4. Theoretical model of fatigue crack growth of a thermoelectric PN-junction bonded to an elastic substrate;Cui;Mech. Mater.,2020

5. Fracture of thermoelectric materials: an electrical and thermal strip saturation model;Wang;Eng. Fract. Mech.,2020

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