Study of wetting promotion mechanism of Sn/Cu interface assisted by ultrasonic vibration from molecular dynamics simulation and experiments
Author:
Funder
Natural Science Foundation of Hebei Province
Publisher
Elsevier BV
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
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Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Understanding wetting behaviors on rough PTFE surfaces towards n-octane/water mixture separation by molecular dynamics simulation;Materials Today Communications;2024-08
2. Study on the wettability of Sn/Cu system under ultrasonic vibration;Materials Today Communications;2024-08
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