Solidification microstructures and calculated mixing enthalpies in CoCrCu containing alloys
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference65 articles.
1. Microstructural development in equiatomic multicomponent alloys;Cantor;Mater. Sci. Eng. A,2004
2. Nanostructured high-entropy alloys with multiple principal elements: novel alloy design concepts and outcomes;Yeh;Adv. Eng. Mater.,2004
3. Formation of simple crystal structures in Cu-Co-Ni-Cr-Al-Fe-Ti-V alloys with multiprincipal metallic elements;Yeh;Metall. Mater. Trans. A,2004
4. Wear resistance and high-temperature compression strength of fcc CuCoNiCrAl0.5Fe alloy with boron addition;Hsu;Metall. Mater. Trans. A,2004
5. Multi-principal element alloys with improved oxidation and wear resistance for thermal spray coating;Huang;Adv. Eng. Mater.,2004
Cited by 17 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Microstructures and hydrogen evolution reaction performance of Ru-M(M=Cu, Ni and Nb) system by magnetron sputtering: The mixing enthalpy effect;Journal of Alloys and Compounds;2024-10
2. Characterisation of Phase Separation in Drop-Tube-Processed Rapidly Solidified CoCrCuFeNi0.8 High-Entropy Alloy;High Entropy Alloys & Materials;2024-06-06
3. Microstructure and Early-Stage Oxidation Behavior of Co-Cr-Cu-Fe-Mn-Ni High-Entropy Alloys;JOM;2023-08-30
4. Design of a novel CoCrFeNiCu0.3 high entropy alloy with desirable mechanical, corrosion and anti-bacterial properties via adjusting Cu distribution;Materials Today Communications;2023-06
5. Antibacterial properties of Cu containing complex concentrated alloys;Materials Today Communications;2022-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3