Effect of grain boundaries and crystal orientation on etching behavior of 12 µm thick rolled copper foil
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference20 articles.
1. Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors
2. Influence of copper foil polycrystalline structure on graphene anisotropic etching
3. Effect of cupric ion concentration on the etching behavior of copper in Electrogenerated Chemical Polishing (EGCP)
4. Development of Flexible and Functional Sequins Using Subtractive Technology and 3D Printing for Embroidered Wearable Textile Applications
5. Orientation dependence of the electrochemical corrosion properties of electrodeposited Cu foils
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Influence of Etchants on Etched Surfaces of High-Strength and High-Conductivity Cu Alloy of Different Processing States;Materials;2024-04-24
2. Effects of grain orientation and grain size on etching behaviors of high-strength and high-conductivity Cu alloy;Materials Today Communications;2024-03
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