Investigating the structures and residual stress of Cux(FeAlCr)100−x film on Ni substrate using molecular dynamics-Reference-Cited by-同舟云学术

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Investigating the structures and residual stress of Cux(FeAlCr)100−x film on Ni substrate using molecular dynamics

Published:2022-06 Issue: Volume:31 Page:103378
ISSN:2352-4928
Container-title:Materials Today Communications
language:en
Short-container-title:Materials Today Communications

Author:

Pham Anh-Vu,Fang Te-Hua,Nguyen Van-Thuc,Chen Tao-Hsing

Funder

Ministry of Science and Technology, Taiwan

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference61 articles.

1. Morphological and microstructural properties of two-phase Ni–Cu films electrodeposited at different electrolyte temperatures;Sarac;J. Alloy. Compd.,2013

2. Corrosion resistance of Ni–Co alloy and Ni–Co/SiC nanocomposite coatings electrodeposited by sediment codeposition technique;Bakhit;Appl. Surf. Sci.,2014

3. Microstructures and mechanical properties of CoCrFeNiAl0.3 high-entropy alloy thin films by pulsed laser deposition;Lu;Appl. Surf. Sci.,2019

4. Study on the changes of ultrasonic parameters over supercritical Ni-Co electroplating process;Chuang;Ultrason. Sonochem.,2020

5. Ultra-low-power preparation of multilayer nanocrystalline NiCo binary alloy coating by electrochemical additive manufacturing;Zhang;Surf. Coat. Technol.,2020

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4. Investigation of interfacial matching between 3C-SiC substrate crystals and its surface layer deposited Cu elements using molecular dynamics simulations;Surfaces and Interfaces;2023-12

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