Author:
Wang Qing,Mou Yun,Liu Jiaxin,Peng Yang,Chen Mingxiang
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference25 articles.
1. Ceramic and glass-ceramic packaging in the 1990s;Tummala;J. Am. Ceram. Soc.,1991
2. Preparation of three-dimensional ceramic substrate by multiple electroforming for UV-LED hermetic packaging;Yang;Ceram. Int.,2019
3. Investigations of the electrochemical performance and filling effects of additives on electroplating process of TSV;Wu;Sci. Rep.,2020
4. Erratum: fast and cost-effective superconformal filling of high aspect ratio through glass vias using MTT additive;Fey;J. Electrochem. Soc.,2017
5. Direct ink writing of 3D cavities for direct plated copper ceramic substrates with kaolin suspensions;Sun;Ceram. Int.,2019
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