Finite element analysis of thermal stress for different Cu interconnects structure-Reference-Cited by-同舟云学术

Finite element analysis of thermal stress for different Cu interconnects structure

Published:2012-11 Issue:11 Volume:52 Page:2856-2860
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ying Wang,Feng-li Ji,Song-song Gao

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. Zhai CJ, Yao HW, Besser PR, et al. Stress modeling of Cu/low-k BEOL-application to stress migration. In: International reliability physics symposium; 2004. p. 234–8.

2. Ogawa ET, Mcpherson JW, Rosal JA, et al. Stress-induced voiding under via connected to wide Cu metal leads. In: International reliability physics Symposium; 2002. p. 312–21.

3. Lim YK, Seet SC, Lee TJ, et al. Stress migration reliability of wide Cu interconnects with gouging via. In: International reliability physics symposium; 2005. p. 203–8.

4. Thermo-mechanical stresses in copper interconnects – a modeling analysis;Shen;Microelectron Eng,2006

5. On the elastic assumption for copper lines in interconnect stress modeling;Shen;IEEE Dev Mater Reliab,2008

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Material Based Structure Design: Numerical Analysis Thermodynamic Response of Thermal Pyrolytic Graphite /Al Sandwich Composites;Applied Composite Materials;2016-06-27