Author:
Jeong Jae-Seong,Park Nochang,Han Changwoon
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference6 articles.
1. Effect of thermomechanical cycling on lead and-lead free (SnPb and SnAgCu) surface mount solder joints;Stam;Microelectron Reliab,2001
2. Microstructure, orientation and damage evolution in SnPb, SnAgCu, and mixed solder interconnects under thermomechanical stress;Chen;Microelectron Eng,2012
3. Cuddalorepatta G, Dasgupta A, Sealing S, Moyer J, Tolliver T, Loman J. Durability of Pb-free solder connection between copper interconnect wire and crystalline silicon solar cells. In: ITHERM; 2006. p. 1232–9.
4. Photovoltaic module performance and durability following long-term field exposure;King;Prog Photovolt: Res Appl,2000
5. Cluintana MA, King DL, McMahon TJ, Osterwald CR. Commonly observed degradation in field-aged photovoltaic modules. In: Photovoltaic specialists conference; 2002. p. 1436–9.
Cited by
69 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献