Author:
Dudek Rainer,Pufall Reinhard,Seiler Bettina,Michel Bernd
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference15 articles.
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4. Dudek R, Walter H, Auersperg J, Schubert A, Michel B, Kieselstein E, et al. Analysis of interface cracking behaviour in electronic packages. In: Int workshop on video-controlled materials testing and in-situ microstructural characterization, Nancy, France, 16–18, 1999.
5. Auersperg J, Michel B. Fracture and damage evaluation in microelectronic assemblies by FEA. In: 9th Int conf on modern materials and technologies, CIMTEC ‘98, Florence, Italy, 14–19 June, 1998, proc symp I – comp modeling and simulation of materials. p. 403–10.
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