Fluid–solid coupling thermo-mechanical analysis of high power LED package during thermal shock testing-Reference-Cited by-同舟云学术

Fluid–solid coupling thermo-mechanical analysis of high power LED package during thermal shock testing

Published:2012-08 Issue:8 Volume:52 Page:1726-1734
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Chen Zhaohui,Zhang Qin,Wang Kai,Chen Mingxiang,Liu Sheng

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference21 articles.

1. LED packaging for lighting application: design, manufacturing and testing;Liu,2011

2. Status and prospects for phosphor based white LED packaging;Liu;Front Optoelectron China,2009

3. Freeform LED lens for rectangularly prescribed illumination;Wang;J Opt A: Pure Appl Opt,2009

4. Design of compact freeform lens for application specific light emitting diode packaging;Wang;Opt Express,2010

5. Optical analysis of an 80W light emitting diode street lamp;Wang;Opt Eng,2008

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