Author:
Park Jongwoo,Osenbach John
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference16 articles.
1. Microelectronic packaging;Tummala,1989
2. Epoxy encapsulation on ceramic quad flat packs (CQFP’s);Clementi;IEEE Trans Comp Pack Manuf Technnol—A,1994
3. A new reliable snap cure die attach adhesive;Galloway;Mat Res Soc Symp Proc,1992
4. Park J et al. Epoxy adhesive used in passive optical component/fiber assembly: cure kinetics, void formation and reliability. In: 51st Electron. Comp. Technology Conf., 2001;397–402.
5. Cleaning solutions based on hydrogen peroxide for use in silicon semiconductor technology;Kern;RCA Review,1970
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