Integrated modeling of Self-heating of confined geometry (FinFET, NWFET, and NSHFET) transistors and its implications for the reliability of sub-20 nm modern integrated circuits-Reference-Cited by-同舟云学术

Integrated modeling of Self-heating of confined geometry (FinFET, NWFET, and NSHFET) transistors and its implications for the reliability of sub-20 nm modern integrated circuits

Published:2018-02 Issue: Volume:81 Page:262-273
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Ahn W.^ORCID,Shin S.H.,Jiang C.,Jiang H.,Wahab M.A.,Alam M.A.

Funder

National Science Foundation through the NCN-NEEDS program

Semiconductor Research Corporation

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference78 articles.

1. Cramming more components onto integrated circuits;Moore,1998

2. The future of high-performance CMOS: trends and requirements;Khakifirooz,2008

3. Threshold voltage model for deep-submicrometer MOSFETs;Liu,1993

4. An analytical model of conductance and transconductance for enhanced-mode mosfets;Ghibaudo;Phys. Status Solidi A,1986

5. Future Directions;Khakifirooz,2008

Cited by 31 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. TREAFET: Temperature-Aware Real-Time Task Scheduling for FinFET based Multicores;ACM Transactions on Embedded Computing Systems;2024-06-29

2. Influence of the Gate Oxide and Back Oxide Material Types on Self-heating Effect in Junctionless FinFET;2024 IEEE 25th International Conference of Young Professionals in Electron Devices and Materials (EDM);2024-06-28

3. Modified SPICE-Compatible Model Integrating NBTI and Self-Heating Effects for VDMOS Transistors;2024 11th International Conference on Electrical, Electronic and Computing Engineering (IcETRAN);2024-06-03

4. On the Severity of Self-Heating in FDSOI at Cryogenic Temperatures: In-depth Analysis from Transistors to Full Processor;2024 IEEE International Reliability Physics Symposium (IRPS);2024-04-14

5. Temperature coefficient of resistance and thermal boundary conductance determination of ruthenium thin films by micro four-point probe;Measurement Science and Technology;2024-04-02