Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling-Reference-Cited by-同舟云学术

Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling

Published:2017-09 Issue: Volume:76-77 Page:444-449
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Sabbah Wissam,Arabi Faical,Avino-Salvado Oriol,Buttay Cyril^ORCID,Théolier Loïc,Morel Hervé

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference15 articles.

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2. A Joint IeMRC-EEPKTN Power-Electronics Roadmap 2007;Johnson,2008

3. An industry-based survey of reliability in power electronic converters;Yang;IEEE Trans. Ind. Appl.,2011

4. Die attach materials for high temperature applications: a review, components, packaging and manufacturing technology;Manikam;IEEE Trans.,2011

5. Survey of high-temperature reliability of power electronics packaging components, power electronics;Khazaka;IEEE Trans.,2015

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