Investigation and application of vertical NPN devices for RF ESD protection in BiCMOS technology

Author:

Huang Guo-LunORCID,Fu Wei-Hao,Lin Chun-YuORCID

Funder

Amazing Microelectronic Corp.

Ministry of Science and Technology

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference22 articles.

1. Overview on ESD protection designs of low-parasitic capacitance for RF ICs in CMOS technologies;Ker;IEEE Trans. Device Mater. Reliab.,2011

2. Engineering of dual-direction SCR cells for component and system level ESD, surge, and longer EOS events;Tazzoli,2015

3. Design of ESD protection for large signal swing RF inputs operating to 24GHz in 0.18μm SiGe BiCMOS process;Parthasarathy,2015

4. Study on the ESD-induced gate-oxide breakdown and the protection solution in 28nm high-k metal-gate CMOS technology;Lin;IEEE Nanotechnology Materials and Devices Conference,2015

5. Influences of substrate pickup integrated with the source-end engineering on ESD/latch-up reliabilities in a 0.35-um 3.3-V process;Chen,2016

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