Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling-Reference-Cited by-同舟云学术

Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling

Published:2017-07 Issue: Volume:74 Page:34-43
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Qiu Delong,Cao Liqiang,Wang Qidong,Hou Fengze,Wang Xugang

Funder

National Natural Science Foundation of China

National Science and Technology

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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