Funder
Universiti Sains Malaysia
Ministry of Higher Education, Malaysia
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference34 articles.
1. Fundamentals of Microsystems Packaging;Tummala,2001
2. Stacked solder bumping technology for improved solder joint reliability;Liu;Microelectron. Reliab.,2001
3. “Chapter 3 - Encapsulation Process Technology”, Encapsulation Technologies for Electronic Applications;Ardebili,2009
4. Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings;Ng;Microelectron. Reliab.,2017
5. Flow time measurements for underfills in flip-chip packaging;Wang;IEEE Trans. Compon. Packag. Technol.,2005
Cited by
27 articles.
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