Author:
Chien Wei-Ting Kary,Zhao Yong Atman,Zhang Liwen,Wang Zhijuan
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference7 articles.
1. Interconnect opportunities for gigascale integration;Meindl;IBM J. Res. Dev.,2002
2. A global view of interconnects;List;Microelectron. Eng.,2006
3. Electrical breakdown in advanced interconnect dielectric;Ogawa,2012
4. Critical ultra low-k TDDB reliability issues for advanced CMOS technologies;Chen,2009
5. The reversed intrinsic curve and voltage dependence for ultra-low k dielectrics;Chien,2015
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2 articles.
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