Author:
Betzwar Kotas A.,Khatibi G.
Funder
Federal Ministry of Science, Research and Economy
National Foundation for Research, Technology and Development
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. Overview of high lead solder (over 85%) in the electronics industry;Menon;J. Mater. Sci. Mater. Electron.,2015
2. Semiconductor Power Devices;Lutz,2011
3. Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules;Dugal;Microelectron. Reliab.,2014
4. Reliability of power cycling for IGBT power semiconductor modules;Morozumi;IEEE Trans. Ind. Appl.,2003
5. Comparison Between Active and Passive Thermal Cycling Stress With Respect to Substrate Solder Reliability in IGBT Modules With Cu Baseplates, PCIM Europe;Schaefer,2014
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