The phenomenon of tin pest: A review-Reference-Cited by-同舟云学术

The phenomenon of tin pest: A review

Published:2017-12 Issue: Volume:79 Page:175-192
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Cornelius Ben,Treivish Shay,Rosenthal Yair,Pecht Michael

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference28 articles.

1. A tin pest failure;Douglas Burns;J. Fail. Anal. Prev.,2009

2. Tin pest issues in lead-free electronic solders;Plumbridge;J. Electron. Mater.,2007

3. Application for new exemption;COCIR,2011

4. Directive 2011/65/EU (RoHS 2) came into force on 21 July 2011. Published in Official Journal L174, 1 July 2011 was transposed into national law by member states by 2 January 2013.

5. Recent observations on tin pest formation in solder alloys;Plumbridge;J. Electron. Mater.,2008

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