Mathematical modelling of moisture transport into an electronic enclosure under non-isothermal conditions-Reference-Cited by-同舟云学术

Mathematical modelling of moisture transport into an electronic enclosure under non-isothermal conditions

Published:2017-12 Issue: Volume:79 Page:526-532
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Staliulionis Ž.,Mohanty S.,Jabbari M.,Hattel J.H.

Funder

Research Council for Technology and Production Sciences, Denmark

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Corrosion criteria for electronic packaging, part I - a framework for corrosion of integrated circuits;Hoge;IEEE Trans. Comp. Hybrids Manu. Techn.,1990

2. Moisture Ingress Into Nonhermetic Enclosures and Packages. A Quasi-steady State Model for Diffusion and Attenuation of Ambient Humidity Variations;Tencer,1994

3. Moisture Ingress into Electronics Enclosures under Isothermal Conditions;Staliulionis,2016

4. Moisture ingress into packages with walls of varying thickness and/or properties: a simple calculation method;Dahan;IEEE Trans. Compon. Pack. T.,2012

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