Realistic climatic profiles and their effect on condensation in encapsulated test structures representing power modules-Reference-Cited by-同舟云学术

Realistic climatic profiles and their effect on condensation in encapsulated test structures representing power modules

Published:2017-09 Issue: Volume:76-77 Page:409-414
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Kremp S.,Schilling O.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. Field-experience based root–cause analysis of power-converter failure in wind turbines;Fischer,2015

2. Transient hygro-thermal-response of power modules in inverters – mission profiling for climate and power loading;Bayerer,2014

3. Empirical study on humidity conditions inside of power modules under varying external conditions;Kremp,2016

4. IEC 60721 Parts 1–3:2002–10, Classification of Environmental Conditions.

5. Experimental study of water absorption of electronic components and internal local temperature and humidity into electronic enclosure;Conseil,2014

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