Finite element analysis of thermal and mechanical stresses due to the grain anisotropy of polycrystalline β-Sn

Author:

Sakamoto JunjiORCID,Ohara Hisakazu,Shibutani Tadahiro

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference22 articles.

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3. A study of the effects of cyclic thermal stresses on a ductile metal;Coffin;Trans. Am. Soc. Mech. Eng.,1954

4. Estimating the thermal fatigue life of lead-free solder joints;Ima;Yamaha Motor Technical Report,2013

5. Low-cycle fatigue failure behavior and life evaluation of lead-free solder joint under high temperature;Zhu;Microelectron. Reliab.,2014

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