Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference30 articles.
1. Through-silicon via and die stacking technologies for microsystems-integration;Beyne,2008
2. Modeling and characterization of TSV capacitor and stable low capacitance implementation for wide-I/O application;Chang;IEEE Trans. Device Mater. Reliab.,2015
3. A novel scallop free TSV etching method in magnetic neutral loop discharge plasma;Morikawa,2012
4. Enhanced etch process for TSV & deep silicon etch;Xu,2015
5. 3D sensor application with open through silicon via technology;Kraft,2011
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献