Author:
Chen Liangbiao,Zhou Jiang,Chu Hsing-wei,Zhang Guoqi,Fan Xuejun
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference40 articles.
1. Effect of hygrothermal aging on interfacial reliability of silicon/underfill/FR-4 assembly;Shi;IEEE Trans. Compon. Packag. Technol.,2008
2. Hygroscopic swelling of polymeric materials in electronic packaging: characterization and analysis;Zhou,2010
3. Moisture Sensitivity of Plastic Packages of IC Devices;Fan,2010
4. Popcorning: a failure mechanism in plastic-encapsulated microcircuits;Gallo;IEEE Trans. Reliab.,1995
5. Package structural integrity analysis considering moisture;Fan,2008
Cited by
20 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献