Solder-joint reliability of HVQFN-packages subjected to thermal cycling-Reference-Cited by-同舟云学术

Solder-joint reliability of HVQFN-packages subjected to thermal cycling

Published:2009-03 Issue:3 Volume:49 Page:331-339
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

de Vries J.,Jansen M.,van Driel W.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Hung SC, Zheng PJ, Ho SH, Lee SC, Wu JD. The comparison of solder joint reliability between BCC++ and QFN. In: Proceedings of electronic components and technology conference; 2001. p. 1052–8.

2. Syed A, Kang WJ, Board level assembly and reliability considerations for QFN type packages. In: Proceedings of surface mount technology association; 2003. p. 181–8.

3. Comprehensive board-level solder joint reliability modeling and testing of QFN and power QFN packages;Tee;Microelectron Reliab,2003

4. A performance and manufacturability evaluation of bump chip carrier packages;Mercado;IEEE Trans Adv Pack,2004

5. Birzer C, Stoeckl S, Schuetz G, Fink M. Reliability investigations of leadless QFN packages until end-of-life with application-specific board-level stress tests. In: Proceedings of electronic components and technology conference; 2006. p. 594–600.

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