Advanced thermal failure analysis and reliability investigations – Industrial demands and related limitations-Reference-Cited by-同舟云学术

Advanced thermal failure analysis and reliability investigations – Industrial demands and related limitations

Published:2008-08 Issue:8-9 Volume:48 Page:1273-1278
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Altes Andreas,Tilgner Rainer,Reissner Markus,Steckert Grazyna,Neumann Gerald

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference34 articles.

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2. Lock-in thermography;Breitenstein,2003

3. Cole Jr EI, Tangyunyong P, Bensonand DA, Barton DL. ESREF; 1999.

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