Author:
Johannessen Rolf,Oldervoll Frøydis,Strisland Frode
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference17 articles.
1. Metallurgical bonding systems for high-temperature electronics;Harman,1999
2. Oldervoll F, Strisland F. Long term reliability of aluminium wire-bonding on ceramic substrate at high temperature. In: Proceedings from the international high temperature conference on high temperature electronics HITEN 2003, Oxford UK, 8–11 July; 2003. p. 165–72.
3. Intermetallic formation in gold–aluminium systems;Philofsky;Solid-State Electron,1970
4. Shuckla R, Deo JS. Reliability hazards of silver–aluminium substrate bonds in MOS devices. In: Proceeding of the 20th annual IEEE reliability physics symposium; 1982. p. 122–7.
5. High temperature aluminium nitride packaging in high-temperature electronics;Martin,1998
Cited by
9 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献