Pressure-induced tin whisker formation

Author:

Shibutani Tadahiro,Yu Qiang,Shiratori Masaki,Pecht Michael G.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference31 articles.

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2. Tin whisker risk assessment;Fang;Circuit World,2006

3. Leidecker H, Brusse J. Tin whiskers: a history of documented electrical system failures. Technical presentation to space shuttle program office; 2006.

4. Xu C, Zhang Y, Fan C, Abys J, Hopkins L, Stevie F. Understanding whisker phenomenon, driving force for the whisker formation. In: Proceedings of the IPC SMEMA council APEX; January 2002. p. S06-2-1–6.

5. An integrated theory of whisker formation: the physical metallurgy of whisker formation and the role of internal stresses;Galyon;IEEE Trans Electron Packag Manuf,2005

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1. An Analytical Model of Spontaneous Whisker Growth on Strain Accumulation From Contiguous Film Network;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-09

2. Insights into the dual-roles of alloying elements in the growth of Sn whiskers;Journal of Materials Science & Technology;2022-08

3. Analysis of Pressure-Induced Whisker Nucleation and Growth in Thin Sn Films;Journal of Electronic Materials;2021-09-05

4. Whisker growth under a controlled driving force: Pressure induced whisker nucleation and growth;Scripta Materialia;2020-06

5. Tin whisker growth on immiscible Al–Sn alloy;Journal of Materials Science: Materials in Electronics;2019-12-07

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