Author:
Shibutani Tadahiro,Yu Qiang,Shiratori Masaki,Pecht Michael G.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference31 articles.
1. Lead-free electronics;Ganesan,2006
2. Tin whisker risk assessment;Fang;Circuit World,2006
3. Leidecker H, Brusse J. Tin whiskers: a history of documented electrical system failures. Technical presentation to space shuttle program office; 2006.
4. Xu C, Zhang Y, Fan C, Abys J, Hopkins L, Stevie F. Understanding whisker phenomenon, driving force for the whisker formation. In: Proceedings of the IPC SMEMA council APEX; January 2002. p. S06-2-1–6.
5. An integrated theory of whisker formation: the physical metallurgy of whisker formation and the role of internal stresses;Galyon;IEEE Trans Electron Packag Manuf,2005
Cited by
33 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献